FOAM POLISHING PAD,MED DENSTY

High-quality foam pads ideal for Professional applications

Partially closed cells are strategically patterned to drastically improve polishing performance by evenly dispersing compound/polishing onto the working surface
Slower rate of polish absorption enhances polishing performance
Reduced surface tension allows operator to run pad flat on the working surface with greatly minimized pad skipping
CCS pockets gradually release compound/polish as required, resulting in increased operator control
Reduced surface contact generates less friction and heat
Curved edges enable easier polishing in corners and along edges
Hook and Loop backing
Machine wash in warm water and air dry to clean
Available in Hard/Cutting, Medium/Polishing and Soft/Finessing densitie

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